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ADVANCED PCB PACKAGING
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Sample Projects |
- High-Density BGAs, QFNs, Micro-Vias, Ultra-Fine Trace and Space
- Hand-Crafted Layout for Memory Systems, Chipsets, High-Speed Designs
- Layout Planning for High-Current Applications (Power Supplies, Motor Control) Minimizing Current Loops
- RF Layout Strategies
- Design for EMI Compliance
- Design for Manufacturability – Stack-Up, Spacing, IPC Footprints
- Specialty Design Considerations
- Controlled Impedance
- High-Speed PCB Materials
- Blind and Buried Vias Thermally Conductive PCB Materials
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