AVID Technologies, Inc.
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PCB LAYOUT AND DESIGN SERVICES

 

AVID's PCB layout group provides electronic packaging, design and simulation services using a suite of advanced tools and highly skilled professional designers.

AVID serves the "who's who" in military/defense, commercial, industrial, consumer, and some of the world's most advanced research organizations.

When quality, delivery, and value are prime factors, AVID is an easy choice.

 

 
 


Areas of Expertise Include:

  • High-Speed Digital Designs to GHZ+ on FR4 and High Performance Materials
  • Low-Level Analog, RF, LVDS, GTL+, PECL, etc.
  • Rocket IO, XAUI,  Hyperport, HOTlink II , etc.
  • DDR/DDR2 and 3,Memory, DVI, Ethernet, USB2, PCI-X, PCI
  • AMD Opteron, INTEL Pentium, Virtex 5 , Stratix GX
 
 


Primary Software Platforms Include:

  • Mentor Graphics – PADS Logic and DxDesigner for PADS Layout
  • Mentor Graphics - DxDesigner and Design Capture for Expedition
  • Mentor Graphics - HyperLynx for Signal Integrity/EMC
  • Mentor Graphics – PADS Layout and Expedition Enterprise
  • Cadence Design Systems - OrCAD Capture/OrCAD Layout
  • Any Netlist Format for Input
  • CAM350 Pre-Fabrication Gerber Verification
 
 


Capabilities:

  • EMC/EMI and Signal Integrity Analysis
    • Pre-Layout Simulation and Analysis Services
    • Termination and Topology Strategies
    • Stack-Up and Impedance and Analysis
    • Post-Layout Simulation and Analysis Verification

  • PCB Design
    • Complete Traditional Printed Circuit Boards 1 to 30 Layers
    • Micro-BGA, Micro-Vias, HDI, Impedance Control
    • Chip-on-Board, Multi-Chip Modules, Die Attach
    • Pre-Layout Thermal Planning
    • Low-Loss Materials, Metal Cores, Heat Plates

  • Bareboard Fabrication
    • Multiple Deliveries and Quantities of all Technologies
    • Pre-Fabrication IPC Netlist Verification of Gerbers
    • IPC Netlist  Board Conformance Testing

  • Assembly and Proto-Typing Services
    • Component Procurement
    • Turn-Key Assembly

  • Mechanical
    • Cabling, System Board Interconnect, Packaging/Enclosures